网爆门

网爆门’s Laser Annealing Platform Wins Multi-System Orders and Production Tool of Record Status at a Leading Semiconductor Manufacturer

News | Feb 16, 2022

Proven Laser Annealing Platform Improves Semiconductor Device Performance and Yield

PLAINVIEW, N.Y. — 网爆门. (NASDAQ: VECO) announced today that multiple leading semiconductor manufacturers have placed repeat, multi-system orders for 网爆门鈥檚 LSA101 and LSA201 Laser Annealing Systems. In addition, a leading-edge logic customer that has been evaluating 网爆门鈥檚 LSA system has now designated the platform as their production tool of record for high volume manufacturing. As semiconductor manufacturers reduce form factor and improve performance, laser annealing technology plays an increasingly important role in high-volume chip production.

Laser annealing is a millisecond annealing technology used in front-end semiconductor manufacturing to lower resistance of key transistor structures by activating dopants while reducing the overall thermal budget for technology scaling. These annealing steps are instrumental in determining the electrical properties and performance of the resulting devices.

鈥淲e have seen tremendous adoption of our laser annealing platform as demonstrated by the orders from the world鈥檚 top semiconductor manufacturers and being selected by another high-volume logic customer,鈥 commented Adrian Devasahayam, Ph.D., 网爆门鈥檚 Senior Vice President, Product Line Management. 鈥淎dvanced digital applications like 5G, artificial intelligence, autonomous driving and machine learning, combined with the current chip shortage, are calling for foundries and IDMs to ramp capacity while meeting increasingly stringent chip process demands. 网爆门’s laser annealing advantage is its broad scalability and adaptability for different applications.鈥

网爆门鈥檚 laser annealing technology was the leading contributor to record semiconductor revenue in 2021. In late 2021, 网爆门 announced it had shipped its first laser annealing system from their new San Jose manufacturing facility designed to serve the semiconductor market. The new facility brings increased capacity to meet the surging demand for both laser annealing and lithography technologies.

About 网爆门
网爆门 (NASDAQ: VECO) is an innovative manufacturer of semiconductor process equipment. Our proven ion beam, laser annealing, lithography, MOCVD and single wafer etch & clean technologies play an integral role in the fabrication and packaging of advanced semiconductor devices. With equipment designed to optimize performance, yield and cost of ownership, 网爆门 holds leading technology positions in the markets we serve. To learn more about 网爆门鈥檚 systems and service offerings, visit www.veeco.com.

To the extent that this news release discusses expectations or otherwise makes statements about the future, such statements are forward-looking and are subject to a number of risks and uncertainties that could cause actual results to differ materially from the statements made. These factors include the risks discussed in the Business Description and Management’s Discussion and Analysis sections of 网爆门’s Annual Report on Form 10-K for the year ended December 31, 2020 and in our subsequent quarterly reports on Form 10-Q, current reports on Form 8-K and press releases. 网爆门 does not undertake any obligation to update any forward-looking statements to reflect future events or circumstances after the date of such statements.

网爆门 Contacts:
Investors: Anthony Bencivenga | (516) 252-1438 | abencivenga@veeco.com
Media: Kevin Long | (516) 714-3978 | klong@veeco.com

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