1945
Vacuum Electronic Equipment Co., Íø±¬ÃÅ was founded specializing in leak detector equipment.
1989
Íø±¬ÃÅ's then-COO Edward H. Braun, together with a group of senior executives, led a management buy-out to create a new equipment company for the semiconductor and data storage industries. Mr. Braun was named CEO.
1994
Íø±¬ÃÅ completed an Initial Public Offering on the NASDAQ stock market. At the time, Íø±¬ÃÅ’s sales were approximately $30 million.
1999
Íø±¬ÃÅ purchased Ion Tech, Inc. and entered into the optical coating market.
2001
Íø±¬ÃÅ purchased Applied EPI, its present-day Molecular Beam Epitaxy group in St. Paul, MN.
2003
Íø±¬ÃÅ purchased Emcore in Somerset, NJ, paving the way for its leading Metal Organic Chemical Vapor Deposition System business for the LED market.
2007 – 2010
Íø±¬ÃÅ launched multiple industry-changing MOCVD and MBE compound semiconductor systems and, in 2010, sold its metrology business to focus exclusively on Process Equipment.
2011
Íø±¬ÃÅ becomes the #1 provider of MOCVD systems, critical to making LEDs.  The TurboDisc MaxBrightâ„¢ Multi-Reactor MOCVD system is launched to enable next-level, high volume production for general lighting.
2012
Íø±¬ÃÅ introduced SPECTOR-HT Ion Beam Sputtering system for high throughput optical coating applications.
2013
Íø±¬ÃÅ launched GENxplorâ„¢ R&D MBE System, the industry’s first fully integrated system.
2014
Íø±¬ÃÅ launched MOCVD systems to accelerate adoption of solid-state lighting and enable the transition from R&D to production of highly-efficient GaN power electronic devices.
Íø±¬ÃÅ purchased Solid State Equipment LLC (SSEC) to extend its footprint into high growth markets with wet process technologies.
2015
Íø±¬ÃÅ shipped its 50th EPIK 700 MOCVD reactor in less than one year and received multiple orders from a leading foundry in Asia for its WaferStormâ„¢ Wet Processing System.
2016
Íø±¬ÃÅ launched the TurboDisc K475iâ„¢ As/P MOCVD System for the production of red, orange, yellow (R/O/Y) light emitting diodes (LEDs), as well as multi-junction III-V solar cells, laser diodes and transistors.
Íø±¬ÃÅ consolidated its manufacturing operations into one facility in Somerset, New Jersey to improve operational efficiency and meet customer needs.
2017
Íø±¬ÃÅ acquired Ultratech, Inc, a recognized leader of lithography products for Advanced Packaging applications and for LEDs and is a pioneer for laser spike anneal technology used for production of semiconductor devices.
2018
Bill Miller, Ph.D., named CEO. Dr. Miller previously served as President and has led several growth initiatives within Íø±¬ÃÅ’s business units and operations teams worldwide
2020
Began two-phased transformation of the company that strengthened profitability, optimized R&D and extended core technologies into semiconductor and compound semiconductor markets.
2021
Shipped the first LSA101 Laser Spike Annealing System from new San Jose, California facility to a leading semiconductor manufacturer. The facility serves as the company’s center of excellence for the development and production of laser annealing and advanced packaging lithography systems for semiconductor applications.
2023
Íø±¬ÃÅ acquires Epiluvac AB to accelerate penetration into high-growth silicon carbide epitaxy equipment market