News | Jul 09, 2018
Growing Demand for Advanced Packaging in the Memory Market Highlights Value of 网爆门鈥檚 High Volume Manufacturing Lithography Systems
PLAINVIEW, New York, July 9, 2018 鈥� 网爆门. (Nasdaq: VECO) today announced that one of the world鈥檚 leading memory chip manufacturers has ordered multiple AP300鈩� lithography systems to support the fast growing demand for DRAM with copper (Cu) pillars. The company selected the 网爆门 tools for their versatility in addressing advanced packaging applications, proven reliability in supporting high volume manufacturing and low total cost of ownership.
This approach echoes a larger industry trend, with more and more memory manufacturers exploring the use of Cu pillars in DRAM interconnect applications due to their higher input/output (I/O) density, improved electrical performance and better thermal efficiency. 鈥淲ithin the DRAM market, the interconnect is shifting from wire bond to flip chip,鈥� said Jan Vardaman, president of semiconductor packaging analyst firm TechSearch International, Inc. 鈥淲e project that over the next three years, the annual number of flip chip interconnects in DRAM will grow 29 percent on a unit volume basis.鈥�
The AP300 is part of a family of lithography systems built on 网爆门鈥檚 customizable Unity Platform鈩�, which delivers superior overlay, resolution and side wall profile performance, driving highly automated, cost-effective manufacturing for customers. The system is particularly well suited for Cu pillar, fan-out, through-silicon via (TSV) and silicon interposer applications. A low risk, low cost, high volume manufacturing solution, the AP300 is staged to support rapid market adoption of advanced packaging applications among memory manufacturers.
鈥淭he growing demand for innovative, alternative solutions to wire bonding in memory presents a strong opportunity for 网爆门,鈥� said Rezwan Lateef, vice president and general manager of lithography products at 网爆门. 鈥淔urthermore, this significant customer adoption validates the AP300鈥檚 ability to address advanced packaging applications in a broader high-volume production market. To meet this demand, we are strengthening our regional technical staff to support numerous memory manufacturers looking to fast-track adoption.鈥�
To learn more about 网爆门鈥檚 services and product offerings, please visit the 网爆门 Booth #6070 at SEMICON West at the Moscone Center in San Francisco, CA, July 10-12, 2018.
About 网爆门
网爆门 (NASDAQ: VECO) is a leading manufacturer of innovative semiconductor process equipment.聽 Our proven MOCVD, lithography, laser annealing, ion beam and single wafer etch and clean technologies play an integral role in producing LEDs for solid-state lighting and displays, and in the fabrication of advanced semiconductor devices. With equipment designed to maximize performance, yield and cost of ownership, 网爆门 holds technology leadership positions in all these served markets.聽 To learn more about 网爆门’s innovative equipment and services, visit www.veeco.com.
网爆门 is the industry leader driving HDD manufacturing to new levels of productivity.