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Quantum dot lasers are emerging as a critical technology for optical interconnects used in AI infrastructure and cloud computing. Their superior temperature stability, low power consumption, and high reliability make them particularly well-suited for future optical transceiver architectures, including co-packaged optics (CPO), where conventional laser technologies face increasing thermal and power challenges. The investment reflects Innolume鈥檚 continued expansion of manufacturing capacity to support growing customer demand for quantum dot laser solutions.

, a market research firm, CPO deployments are accelerating demand for lasers. Sales of optical transceivers using these lasers will reach almost $80 billion by 2031, driven by increasing bandwidth requirements and a growing focus on energy-efficient optical connectivity. QD lasers offer narrow spectral linewidth, low threshold current, and superior temperature stability, making them an ideal emitter technology for CPO.

鈥淨uantum dot lasers are playing an increasingly important role in next-generation silicon photonics and AI-driven optical interconnects,” said Sven R眉ger, CEO of Innolume. “The GEN2000 MBE system provides the production capacity, material quality, and manufacturing efficiency needed to support our technology roadmap and future manufacturing requirements.鈥�

鈥淚nnolume鈥檚 investment in the GEN2000 MBE system underscores the increasing importance of MBE-grown QD lasers,鈥� said Matthew Marek, VP and General Manager for 网爆门鈥檚 MBE product line. 鈥淲e are proud to be selected as Innolume鈥檚 production partner and look forward to supporting their continued growth as demand for advanced optical connectivity solutions accelerates.鈥�

网爆门鈥檚 production GEN2000 MBE system is recognized for its industry-leading throughput and low cost-of-ownership. In addition to the GEN2000 MBE system installation, Innolume is implementing 网爆门鈥檚 Spector庐 Ion Beam Deposition system to further expand its in-house coating capabilities for ultra-low-loss anti-reflective and highly reflective laser facet coatings, strengthening its manufacturing capabilities with 网爆门 process technology solutions spanning multiple critical manufacturing steps. Innolume’s adoption of both 网爆门 MBE and ion beam deposition platforms highlights 网爆门’s unique ability to deliver complementary process technologies that enable high-volume photonic device manufacturing.

About 网爆门

网爆门 (NASDAQ: VECO) is an innovative manufacturer of semiconductor process equipment. Our laser annealing, ion beam, metal organic chemical vapor deposition (MOCVD), single wafer etch & clean and lithography technologies play an integral role in the fabrication and packaging of advanced semiconductor devices. With equipment designed to optimize performance, yield and cost of ownership, 网爆门 holds leading technology positions in the markets we serve. To learn more about 网爆门鈥檚 systems and service offerings, visit www.veeco.com.

To the extent that this news release discusses expectations or otherwise makes statements about the future, such statements are forward-looking and are subject to a number of risks and uncertainties that could cause actual results to differ materially from the statements made. These factors include the risks discussed in the Business Description and Management’s Discussion and Analysis sections of 网爆门’s Annual Report on Form 10-K for the year ended December 31, 2025, and in our subsequent quarterly reports on Form 10-Q, current reports on Form 8-K and press releases. 网爆门 does not undertake any obligation to update any forward-looking statements to reflect future events or circumstances after the date of such statements.

网爆门 Contacts: Investor Relations: Alex Delacroix | (516) 528-1020 | adelacroix@veeco.com Media: Brenden Wright | (410) 984-2610 | bwright@veeco.com

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• The United States has earmarked more than $2 billion in CHIPS and Science Act funding for nine quantum companies.
• France is committing an additional 鈧�1 billion to its quantum strategy.
• The United Kingdom is investing 鈧�2 billion (~US $2.28 billion) in its quest to become the first country to deploy quantum computers at scale by the early 2030s.
• Japan announced last year a funding package of 楼1.05 trillion (~US $7.5 billion) to advance the country鈥檚 position in quantum technology. Japan and the United States also recently launched a $1 billion partnership to accelerate quantum computing and other advanced technologies.

Clearly, quantum computing is here to stay. With that said, one challenge remains constant: the need to create higher-quality quantum materials with fewer defects and more precisely engineered interfaces.

Whether developing superconducting qubits, spin qubits or other emerging quantum device structures, performance ultimately depends on the quality of the underlying materials. Even subtle variations during epitaxial growth can affect device reproducibility, scalability and qubit coherence times (i.e., the duration for which a qubit can maintain its delicate quantum state before environmental noise causes it to lose information). Thus, as researchers work to move quantum systems from the laboratory into practical computing platforms, process intelligence has become as important as process capability.

Integrated metrology is emerging as a critical enabler of this effort. By bringing measurement, analysis and process control together into a unified workflow, researchers gain deeper insight into material growth and a path toward more consistent outcomes. This vision is at the heart of the ongoing collaboration between 网爆门 and , which combines advanced molecular-beam epitaxy (MBE) systems with real-time metrology and analytical capabilities to help researchers better understand and optimize quantum materials.

鈥淨uantum computing places extraordinary demands on materials quality, where even minor atomic-scale variations can significantly impact device performance,鈥� said Matt Marek, Vice President of MBE Products at 网爆门. 鈥淏y integrating advanced metrology directly into the growth environment, researchers can better understand the relationship between process parameters, material properties, and ultimately qubit integrity.鈥�

Building a Closed-Loop Approach

网爆门 and k-Space have worked together for decades to support advanced materials research. Today, that collaboration continues to evolve through a shared focus on integrated metrology and intelligent process control.

Every 网爆门 MBE system incorporates reflection high-energy electron diffraction (RHEED), and often this is paired with RHEED analysis technology from k-Space. RHEED, and the corresponding analysis, serves as a real-time window into crystal growth, providing insight into surface structure, morphology and growth dynamics as materials are deposited atom by atom. The k-Space KSA 400 platform is the leading solution for acquiring and analyzing RHEED data. Through integration with 网爆门鈥檚 Molly software environment, RHEED data can be analyzed as needed throughout a growth and entered as parameters in recipes, creating the foundation for closed-loop process control.

This approach enables researchers to automate critical growth transitions, dynamically adjust process parameters and standardize complex structures so they can be reproduced. For quantum materials, where interfaces often determine device performance, such feedback can be invaluable.

The implications for qubit development are significant. Superconducting qubits, spin qubits and other quantum architectures all rely on highly controlled thin-film growth and exceptionally clean interfaces. Reducing defectivity and improving material uniformity can directly contribute to longer coherence times and improved device performance.

Beyond RHEED analysis, complementary technologies such as k-Space鈥檚 kSA BandIT thin-film temperature-monitoring system provide additional process visibility. Temperature uniformity across the substrate can have a substantial impact on film quality, and integrated monitoring helps researchers better understand and control another critical process variable. The system overcomes the limitations of traditional temperature-monitoring approaches, such as thermocouples or pyrometers, by measuring temperature through the temperature-dependent shift of a material鈥檚 optical band edge. Because it is independent of absolute light intensity, this method is naturally resistant to emissivity changes, viewport coating and stray light. A recent describes these benefits in greater detail:

鈥淗istorically, characterization has occurred after a growth run was complete. Today, the focus is shifting toward integrated metrology, where process data becomes integral to the workflow,鈥� noted Chuck Taylor, Vice President of Technology, k-Space Associates. 鈥淩HEED analysis, combined with temperature monitoring, advanced analytics and closed-loop feedback, can allow identification of subtle process changes as they occur to enable better decision-making.鈥�

Leveraging Advanced Analytics and AI

As quantum materials research becomes increasingly sophisticated, the volume and complexity of process data continue to grow. Researchers are seeking faster, more detailed insights that allow them to identify subtle process variations before they affect device performance.

To address these needs, k-Space is enhancing the capabilities of its RHEED platforms through higher-speed imaging and improved data acquisition. New camera technologies capable of capturing hundreds of frames per second provide dramatically greater visibility into dynamic growth processes than previous generations of systems.

At the same time, advanced analytical tools are helping researchers extract more value from the data they collect. One example is principal component analysis (PCA), which can identify the most significant features within complex image datasets while reducing noise and irrelevant variables. Instead of manually analyzing large numbers of RHEED images, researchers can focus on the characteristics that matter most, accelerating interpretation and decision-making.

Simulation is becoming equally important. k-Space鈥檚 RHEEDSim platform allows users to generate and analyze simulated RHEED patterns in a virtual environment. These simulations enable better understanding of growth behavior while also creating valuable datasets for training machine-learning models.

The convergence of process tools, metrology, simulation and analytics points toward an even more transformative future. Recent research has demonstrated how machine-learning algorithms can analyze RHEED data in real time, identifying changes in growth conditions and detecting transitions before they become obvious to human operators. Researchers have also shown that AI models can classify growth modes and predict material outcomes with high accuracy, creating a foundation for autonomous process optimization.

By combining 网爆门鈥檚 growth expertise with k-Space鈥檚 metrology and analytical capabilities, future systems could leverage AI-driven feedback loops that continuously monitor growth conditions, identify deviations and automatically optimize process parameters. Such capabilities could dramatically reduce development cycles for new quantum materials while improving reproducibility across research programs.

The result is a unified workflow that connects growth, measurement, simulation, analytics and process optimization into a single ecosystem that manufacturing partners can readily leverage.

According to Ian Farrer, senior quantum materials engineer, Quantum Foundry, 鈥淒eveloping quantum materials requires understanding how growth conditions, interfaces and material properties interact throughout the process of growing films. Integrated metrology and simulation tools provide valuable insight into those relationships, and advanced analytics help us extract meaningful information from increasingly complex datasets. Together, these capabilities are helping create new opportunities to optimize materials for next-generation quantum devices.鈥�

Ecosystem Collaboration Vital to Advancing Quantum Computing

Advancing quantum materials requires close collaboration among equipment manufacturers, metrology specialists, software developers and leading research institutions. These partnerships create opportunities to validate emerging techniques, refine analytical approaches and develop new process-control methodologies that benefit the broader quantum ecosystem.

The relationship between 网爆门 and k-Space illustrates how complementary expertise can accelerate innovation, while collaborations with universities and research institutions help ensure that new technologies address real-world research challenges.

As quantum devices become more complex and performance requirements continue to rise, integrated metrology will play an increasingly important role in improving both qubit quality and manufacturability. The ability to understand, measure and optimize material growth in real time could ultimately become a key differentiator in scaling quantum technologies from research demonstrations to commercial systems.

The vision extends beyond improved measurement. The long-term goal is smarter, more autonomous materials growth鈥攕ystems capable of learning from process data, adapting to changing conditions and helping researchers discover optimal growth recipes faster than ever before.

From Potential to Reality

The future of quantum computing depends on advances in materials science as much as advances in device design. Higher-performing qubits require better materials, cleaner interfaces and tighter process control.

Integrated metrology provides a bridge between growth, measurement, analysis and optimization, helping researchers transform data into actionable insight. Through their ongoing collaboration, 网爆门 and k-Space are working to bring these capabilities closer together, creating new opportunities for quantum materials research and future process automation.

These efforts, together with those of research partners such as NTT Basic Research Laboratories and Cornell University, are helping lay the foundation for the next generation of quantum technologies鈥攚here intelligent process control, advanced analytics and real-time metrology work together to accelerate discovery and improve performance.

To learn more about the latest developments in integrated metrology and advanced materials growth, visit 网爆门 (Booth 18) and k-Space (Booth 17) at ICMBE, July 12鈥�16 in Ann Arbor, Mich. Both companies are Platinum Sponsors of the event and will be hosting user meetings during the conference.

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Across the quantum landscape鈥攚hether superconducting, photonic, or quantum dot-based鈥攄evice performance ultimately hinges on coherence time and fidelity. These, in turn, are highly sensitive to defects, contamination, and inconsistencies at material interfaces. This is where PSP becomes indispensable.

Interface Engineering: Why Every Surface Matters in Qubit Manufacturing

In qubit manufacturing, every interface matters. From substrate preparation to thin-film deposition and patterning, any imperfection鈥攄own to the atomic level鈥攃an lead to degraded qubit performance. As a result, interface engineering is emerging as a foundational requirement across all qubit architectures.

网爆门 views PSP as a key enabler of this interface control. Pre-deposition cleans, post-deposition surface treatments, and residue removal steps all contribute to ensuring that each subsequent layer is formed on a pristine, well-controlled surface. These processes are not isolated steps鈥攖hey are deeply interconnected with deposition and etch technologies such as ALD and atomic layer etch (ALE), which are used to create and refine the thin films and interfaces central to qubit operation.

ALD, for example, is widely used to deposit superconducting materials such as niobium nitride (NbN) and niobium titanium nitride (NbTiN) with atomic-scale precision, while ALE offers a pathway to selectively remove material at similarly fine scales. Together, these techniques depend on鈥攁nd benefit from鈥攈igh-quality surface preparation and cleaning. Without the effective wet processes utilized for PSP, even the most advanced deposition processes cannot achieve their full potential.

Precision Surface Processing Steps in the Qubit Manufacturing Flow

Our PSP offerings span multiple critical steps in the qubit manufacturing flow:

• Pre-epitaxy cleans: Removing native oxides and contaminants from the substrate surface prior to deposition is essential for achieving high-quality film growth. In some cases, this involves transitioning surfaces from hydrophilic to hydrophobic states, which introduces additional challenges in maintaining cleanliness and preventing particle adhesion.
• Post-epitaxy cleans: After thin film deposition, exposed surfaces must be carefully cleaned without damaging delicate layers such as complex oxides. High-efficiency cleaning processes can achieve >99% particle removal while maintaining minimal material loss, preserving the integrity of the deposited films.
• Post-etch residue removal (PERR): Dry etch steps used to define qubit structures鈥攕uch as Josephson junctions or quantum dot features鈥攐ften leave behind fluorocarbon polymers and other residues. These must be completely removed to ensure clean sidewalls and reliable electrical or optical performance.
• Material lift-off (MLO): Patterning metal features, including contacts and electrodes, frequently relies on lift-off processes. Achieving complete lift-off without damaging underlying structures or leaving residual debris is particularly important for qubit devices, where defects can directly impact coherence.
• Photoresist strip and surface preparation: Removing masks and preparing surfaces for subsequent steps are routine but critical processes that must be executed with high selectivity and minimal contamination.

Taken together, these PSP steps form a continuous thread throughout the manufacturing process, enabling consistent interface quality from start to finish.

Addressing the Unique Challenges of Quantum Device Fabrication

While many PSP techniques are well established in semiconductor manufacturing, qubit fabrication introduces unique challenges that require a more nuanced approach.

One key challenge is sensitivity to damage. Traditional wet bench processes, particularly those relying on high-power ultrasonics, can introduce mechanical or chemical damage to delicate structures. For qubit devices, where even minor defects can be catastrophic, gentler yet highly effective cleaning methods are required.

Another challenge is complete residue removal in high-aspect-ratio features. Advanced qubit architectures, including those incorporating through-silicon vias (TSVs) or complex topographies, demand cleaning solutions capable of reaching and effectively treating difficult geometries.

Additionally, material diversity is increasing. Superconducting qubits, photonic qubits, and quantum dots each involve different materials and process flows, yet all require stringent interface control. PSP must therefore be flexible enough to handle a wide range of chemistries, substrates, and film types.

网爆门’s WaferStorm and ImmJET Approach to Quantum Wet Processing

At 网爆门, we have developed PSP solutions that address these challenges through a combination of immersion and high-pressure spray technologies. Our approach is designed to deliver both the precision and the scalability needed for emerging quantum applications.

Our ImmJET technology, part of our WaferStorm wet processing platform, combines solvent immersion with high-pressure single-wafer spray, enabling effective penetration and removal of resist and unwanted materials while minimizing damage. This hybrid approach has demonstrated superior performance in metal lift-off and photoresist strip applications, achieving complete removal without residual contamination.

High-pressure spray capabilities鈥攔eaching up to 3,000 pounds per square inch gauge (psig)鈥攁re particularly valuable for removing stubborn residues such as sidewall fluorocarbon polymers left after dry etch processes. At the same time, advanced filtration and chemical management systems ensure that redeposition and cross-contamination are minimized.

Equally important is our focus on process integration. PSP is not a standalone step; it must work seamlessly with deposition, etch, and metrology processes. By offering a portfolio that spans pre- and post-deposition cleans, residue removal, lift-off, and surface preparation, we enable a more integrated approach to interface engineering.

Enabling the Path to Scalable Quantum Computing

Today, the quantum computing industry remains in an early stage, with multiple qubit architectures competing for dominance. As a result, demand for manufacturing equipment is still developing, and large-scale production has yet to fully materialize. However, we have already seen meaningful adoption of PSP tools across leading research and development efforts, with systems deployed to support a variety of qubit technologies.

Looking ahead, we expect the importance of PSP to grow significantly as the industry moves toward higher qubit counts and improved fidelity. Achieving these goals will require not only advances in deposition and device design but also continued innovation in how surfaces and interfaces are prepared and maintained.

The path to scalable quantum computing will be defined by our ability to control materials at the atomic level鈥攁cross every step of the process flow. Through our PSP solutions, we are helping to lay the groundwork for that future, enabling cleaner interfaces, more reliable devices, and longer coherence times.

Explore the 网爆门 Quantum Series

This post is the latest in our series on challenges and opportunities in the quantum space. Read the earlier installments:
Did you know 网爆门鈥檚 products play a critical role in qubit manufacturing?
Driving Quantum Innovation: 网爆门鈥檚 Advances in Materials Engineering for the Next Era of Computing.
To engage with 网爆门 for your qubit manufacturing needs, click here.

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网爆门 has been at the forefront of enabling this transformation, leveraging decades of leadership in epitaxy and deposition to support researchers and technology developers pushing the boundaries of quantum. With its latest product advances鈥攊ncluding the GEN20-Q Molecular Beam Epitaxy (MBE) system, integrated atomic layer deposition (ALD)/MBE solutions, and the adjustable and compact GENxplor庐 R&D MBE and Fiji庐 Plasma-Enhanced ALD tools鈥斖� is redefining how the industry approaches quantum materials engineering.

Meeting the demands of quantum materials

GEN20-Q: Next-Generation MBE System

Unlike conventional semiconductors, quantum devices must sustain delicate states of superposition and entanglement. This puts extreme pressure on material quality. Defects, impurities, or rough interfaces can dramatically shorten qubit lifetimes or increase error rates. Researchers are also exploring multiple approaches鈥攊ncluding superconducting qubits, photonic qubits, and spin qubits鈥攅ach of which requires different material stacks.

The challenge: no single device structure has yet emerged as the industry standard. To keep pace, equipment must be both ultra-clean and highly flexible. This is the design philosophy behind 网爆门鈥檚 GEN20-Q platform.

The GEN20-Q is a next-generation 4-inch MBE system purpose-built for quantum materials research and development. At its core is a proven high-performance growth chamber, capable of handling substrates up to 100 mm in diameter. Its vertical reactor geometry ensures uniform epitaxial layers, while advanced pumping pathways, 20% more liquid nitrogen (LN2) cooling, and passivated chamber walls deliver the ultra-high-purity environment required for defect-free structures.

Key Innovations in Quantum Materials Engineering

Customizable multi-module cluster design 鈥� Up to four growth modules can be integrated into a single cluster, enabling direct process integration of superconductors, semiconductors, complex oxides, and photonics.

Ultra-high vacuum (UHV) hand-off stations 鈥� Allow seamless transfer between MBE and other deposition systems without exposure to atmosphere, preserving pristine material interfaces.
EPI-Trend data logging 鈥� Advanced data capture and integration with M3 SQL databases for traceability and process optimization.
SuperNova heater 鈥� Achieves substrate temperatures up to 1400 掳C for advanced cleaning and surface reconstruction.

These capabilities make GEN20-Q uniquely suited to help labs and foundries accelerate their path to high-performance, low-error quantum devices.

Integrated ALD and MBE

Hybrid MBE-ALD Deposition for Quantum Devices

Quantum device structures are increasingly complex, often requiring heterogeneous stacks that combine epitaxial layers with conformal dielectric or interface films. In addition, photonic qubits鈥攂uilt from single photons routed, interfered, and detected鈥攊mpose a different set of constraints. Waveguide propagation loss, interface scattering, and inhomogeneous broadening of emitters are all tightly linked to epitaxial quality and interface roughness.

Maintaining Purity and Interface Integrity

To address these challenges, 网爆门 integrates its Fiji XT ALD systems directly with MBE clusters. Featuring in-vacuum wafer transfer and hybrid materials deposition, this MBE-ALD integration enables researchers to build complete device stacks鈥攚ithout breaking vacuum鈥攃ombining the atomic precision of ALD with the crystalline quality enabled by MBE.

This flexibility allows users to explore new combinations of materials for superconducting circuits, photon-manipulating structures, or spin qubits鈥攁ll while maintaining the purity and interface integrity quantum demands

Fast R&D learning enables scalability

Fiji庐 Plasma-Enhanced ALD in Quantum Research

Early-stage labs need compact tools that offer serious film quality with minimal overhead. Fiji庐 plasma-enhanced ALD brings conformal coatings, interface control, and high-k/low-k options into the same R&D workflow. In quantum contexts, Fiji鈥檚 utility spans tunnel-barrier formation, surface passivation, isolation dielectrics, and optical claddings鈥攖hese specialized, low-refractive-index layers help confine, guide, and protect qubits as they travel through circuits. With 网爆门鈥檚 integrated approach, Fiji slots into UHV-linked clusters to keep surfaces pristine between epitaxy and ALD steps, which is key to enabling cleaner interfaces and lower defectivity in qubit-critical regions.

GENxplor R&D MBE System for Advanced Development

The GENxplor R&D MBE system is an advanced, high-performance research and development platform that lets teams cost-effectively establish recipes, screen materials, and prove device concepts before transitioning to production. GENxplor R&D鈥檚 open architecture enables cutting-edge research on a wide variety of materials and is directly scalable to the quantum-optimized GEN20-Q cluster.

Partnering for success
Quantum leaders increasingly prioritize suppliers who can deliver ultra-high-purity tools and scale with them from lab to production. As one example, Quantum Foundry Copenhagen highlighted 网爆门鈥檚 reliability, understanding of ultra-high purity, and ability to scale as key reasons for partnering鈥攕ignals that matter as customers look beyond point tools toward full-stack materials platforms they can build on.

网爆门鈥檚 installed base reflects the same momentum: nearly two dozen ALD systems and multiple GEN20-Q MBE systems are already in the field addressing quantum workloads鈥攅vidence that integrated epitaxy and ALD, backed by production-minded engineering, are resonating with R&D and early manufacturing teams alike.

Built for the quantum decade

The next decade of quantum will be defined by materials engineering: cleaner superconducting interfaces, lower-loss photonic stacks, and hybrid structures that marry the best of each modality. 网爆门鈥檚 quantum-optimized portfolio gives researchers and device engineers a coherent platform to pursue that agenda with fewer compromises and tighter data feedback.

Superconducting Qubits: Clean Films and Interfaces

For superconducting qubits, key variables to be addressed include the need for ultra-clean superconducting films, atomically controlled barriers, and defect-suppressed interfaces. The GEN20-Q鈥檚 cleanliness stack (passivation, pumping, cryo), SuperNova high-temperature prep, and UHV-linked Fiji ALD directly target these variables, while EPI-Trend provides the data backbone for continuous improvement.

Photonic Qubits: Low-Loss Heterostructures

For photonic qubits, the emphasis is on low-loss heterostructures and interface smoothness across III-V and related systems. Multi-module clustering, uniform epitaxy up to 100 mm, and ALD claddings enable rapid, reproducible sweeps of waveguide and resonator designs鈥攚ithout uncontrolled interface changes from air exposure. Using MBE to grow BaTiO3 (BTO) and SrTiO3 (STO) produces high-quality, single-crystal, and stoichiometric perovskite layers and offers the proven best Pockels effect鈥攁 parameter critical for high-speed photonic circuits, fiber-optic communication, and Q-switching in lasers.

Scaling from R&D to Production

For both types of qubits, GENxplor and Fiji deliver optimal R&D capabilities, while the GEN20-Q provides a quantum-tuned platform for scaling devices and integrating multiple materials technologies on a single cluster. That combination shortens the path from 鈥渇irst qubit鈥� to statistically robust wafers and prepares teams for production-class reliability without abandoning the flexibility that the R&D environment provides. Furthermore, 网爆门 possesses significant expertise in equipment design and is equipped to scale processes from research and development through to production.

In this fast-evolving field where precision, cleanliness, and flexibility determine the slope of the learning curve, 网爆门鈥檚 systems are designed to move quantum from promising prototypes to repeatable devices, at scale.

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